Qualcomm Snapdragon 855 mobile platform, 3D Sonic Sensor announced

At the Snapdragon Tech Summit 2018 in Maui, Hawaii, Qualcomm announced the next-gen top tier chipset that will be powering the 2019 flagship smartphones. The new chipset will be called Snapdragon 855, and it will bring some key upgrades. Today, Qualcomm only made the announcement, but it will talk about the chipset in detail tomorrow.

The new SoC will come with 4th gen AI engine which will bring 3X improvements compared to the Snapdragon 845. Qualcomm also announced the 3D Sonic Sensor, an ultrasonic fingerprint scanner that will work even when the screen guard is applied. The sensor will also be able to scan your finger if it is oily, greasy and wet, and unlock the device.